The stamp size miniature vital sign detection chip was successfully developed

Vital sign monitoring devices used in medical care are often very expensive and the equipment is very large. But now the situation seems to be improving. A new type of sensor is being developed, and its compactness can even be easily embedded in a bandage. Designed by electrical engineers at Oregon State University, the microchip is fully prepared for clinical trials, and patents are pending.

The size and thinness of this system-on-a-chip device is basically the same as a stamp. Of course, the battery is not counted, but the design of the sensor is designed like this: the device can be sent by any mobile phone. The wireless RF energy drive can receive this energy within 4.5 meters, of course, other than the mobile phone can also be used to transmit radio frequency equipment. The researchers say that in theory, even people's body heat or kinetic energy is enough to drive this product.

Dr. Patrick Chiang, associate professor of electrical engineering and computer science at Oregon State University, said: "This application, already approved by the FDA (Food and Drug Administration), will be opened by suppliers Corventis and iRhythm. The previously designed solution is in size. It is five times larger than the final solution, and the battery is also very important. This design will have similar products such as motion tracking equipment or heart rate measuring instrument in the future consumer market."

Currently, consumer-grade monitoring devices on the market generally cost $100 or more, and the new product is used up and lost. According to the media online report in Oregon, the cost is only $0.25. In addition, this design is also useful in other areas, such as the use of EEG signals, and is also useful for clinics that treat dementia.

Dr. Chiang added: "It is very helpful for medical, health care, disease prevention and other aspects by dramatically reducing the product specifications to such size, weight and cost."

The study was presented at the Custom Integrated Circuits Conference in San Jose, California. Oregon State University also said that this development will be extended to other aspects in the future, and product development work with more partners.

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